Zymet’s reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP. The work was performed in a collaborative effort between Portland State ...
Endicott, N.Y.— Endicott Interconnect Technologies has developed a semiconductor package marketed under the brand-name CoreEZ, which uses an organic, thin core build-up flip chip technology that ...
High-reliability rad hard MOSFETs undergo extensive screening and quality conformance testing to ensure that devices perform to specification in the harshest environments. For Defense Logistics Agency ...
Product reliability is essential for success, especially for electronic products like printed circuit boards (PCB). Accelerated life testing (ALT) is an expedient and cost-effective solution to ...
STAr Technologies, a leader in parametric and reliability test systems today has launched STAr Pluto series tester to meet test needs for both Package- and Wafer-level reliability test systems. This ...
Reliability allocation methods play a pivotal role in engineering, serving as the means by which system-level reliability requirements are systematically distributed among individual subsystems and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback