For more information on these product releases, please visit www.carsim.com. Editors' Note: Screen images of the 2016 CarSim, TruckSim and BikeSim releases are ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Hardware-in-the-loop (HiL) refers to testing a component while embedding it in one or more of its likely environments. These environments are represented virtually by computer models. The tested ...
For five years, a single idea dominated Chinmay Shrivastava's thoughts: humans didn't have enough hours in the day to build the designs of the future. An avid lover of science fiction, Chinmay ...
“Addressing complex engineering challenges such as developing products that are more powerful, yet greener, lighter yet stronger requires a fully-integrated CAE solution,” said Jean-Claude Ercolanelli ...
MUNICH--(BUSINESS WIRE)--SimScale GmbH announced new features for engineers focused on structural and mechanical simulation, including large scale vibration analysis and modal-based harmonics.
PITTSBURGH — August 24, 2022 – Ansys (NASDAQ: ANSS) said today that Ansys Mechanical is one of the first commercial finite element analysis (FEA) programs supporting AMD Instinct accelerators, the ...
Have you ever wondered how to eliminate internal delamination inside your semiconductor package, or how to reduce warpage of your large ball-grid array (BGA) package to eliminate non-wets during board ...
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