SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...

The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with ...

JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of JESD328: LPDDR5/5X Small Outline ...

TL;DR: NVIDIA's new SoCAMM memory module, developed with Samsung, SK hynix, and Micron, features 16-stacked LPDDR5X chips using copper wire bonding for improved thermal efficiency. Micron leads mass ...

Micron is taking its Crucial LPCAMM2 memory modules to new heights in terms of speed. Designed for thin, high performance laptops, LPCAMM2 (Low-Power Compression-Attached Memory Module 2) is a ...

TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory ...

During a recent earnings call, memory maker SK hynix confirmed that it is preparing bigger-capacity GDDR7 memory chips for future GPU launches. Specifically, the company is readying 24-gigabit ...

Penguin Solutions, Inc. (Nasdaq: PENG), a leading provider of high-performance computing and AI infrastructure solutions, today announced the release of its SMART 64GB DDR5-6400 ECC CSODIMM memory ...

We know, we know. Advances in memory technology aren't usually as sexy as, say, a game-changing display format. But these steps ahead are integral to the computer industry, fueling the performance ...

SECO has launched the SOM-COMe-BT6-PTL, a new COM Express Type 6 module powered by new Intel Core Ultra Series 3 processors, which have just launched at CES in Las Vegas. The module provides customers ...