System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...
December 2, 2013. GOEPEL electronic has extended its SCANFLEX boundary scan hardware product range by introducing the SFX Gang Test Module Kit for parallel test and programming of up to 32 different ...
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