SAN JOSE –KLA-Tencor Corp. today said it is the first company to supply a fully automated system for inspection of wafer backsides during the production of 0.13-micron ICs on 300-mm silicon substrates ...

The semiconductor industry has relied on a simple equation for more than five decades — shrink the transistor, pack more onto every wafer, and watch performance soar as costs plummet. While each new ...

KLA-Tencor Corp. hopes to open a new market for wafer backside inspection with the introduction of an automated wafer backside inspection module today for its Surfscan 300mm-defect inspection tool.

Backside power delivery is being called a game changer — a breakthrough technology and the next great enabler in CMOS scaling. It promises significant PPA advances, including faster switching, lower ...

FREMONT, Calif., May 06, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer-processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

With a focus on parallel optimization and nanoscale accuracy, precision positioning specialist PI is streamlining the optical alignment, test and packaging of quantum photonic devices Parallel lines: ...

TOKYO--(BUSINESS WIRE)--USHIO INC., (Headquarters: Tokyo, Japan; President and Chief Executive Officer: Shiro Sugata, http://www.ushio.co.jp/en/) (TOKYO:6925), today ...