Power Integrations recommends the use of IR/convection reflow for surface-mount attach of the InSOP package. However, the InSOP package was designed with wave soldering in-mind in case IR/ convection ...

This application note focuses on Power Integrations Qspeed™ devices which are lead-free and comply with RoHS standard and other environmental requirements. This document covers the typical wave ...

Applying liquid solder to the underside of printed circuit boards in order to bond the chips and discrete components that are placed on top of the board and whose metal leads (pins) extend through the ...

In this guest blog post, taken from the Eurocircuits blog, Ben Verwaest considers whether hand-soldering can reach the same high quality result as reflow or wave soldering. In this guest blog post, ...