A research team at Pohang University of Science and Technology (POSTECH), has developed a novel dry adhesive technology that ...

Research led by the National Institute of Biological Sciences in Beijing has discovered that switching on a single dormant ...

In effect, Calibre Vision AI closes the gap between world-class innovation and everyday usability, making AI-powered DRC debug a real asset for chip design teams of any size. Cycle time reduction and ...

Esophageal adenocarcinoma (EAC), one of two major forms of esophageal cancer, is the sixth most deadly cancer worldwide for which no effective targeted therapy exists.

This paper proposes the use of ROs (Ring Oscillators) for process shift and process spread detection for silicon debugging and model-hardware correlation. ROs are designed to be sensitive to either ...

This valuable study identifies asymmetric dimethylarginine (ADMA) histones as potential determinants of the initial genomic binding of Rhino, a Drosophila-specific chromatin protein essential for ...

In a nutshell: Apple is on track to become the first handset maker to ship a smartphone powered by processing hardware based on TSMC's 2nm process. The chip, tentatively referred to as the A20 ...

In this paper, we report a basic study on wafer level chip size packaging (WL-CSP) process of SAW devices using low temperature sacrifice process. We used the dry film photoresist as sacrifice layer ...

Samsung and Groq to produce world's fastest AI chip using 4nm process, mass production slated for 2H25. Amy Fan, Taipei; Charlene Chen, DIGITIMES Asia Wednesday 11 June 2025 0. Credit: Groq.

In this study, an intense pulsed light (IPL) flip-chip bonding process was investigated to enhance the mechanical reliability of solder joints in flip-chip ball grid array (FC-BGA) packages. The ...