ASMPT Secures Additional Orders for 15 Chip-to-Substrate Thermo-Compression Bonding Tools — AI Tailwind

ASMPT wins repeat orders for 15 C2S TCB tools from a major OSAT partner, positioning to capture significant share of a ...

ASMPT Secures Additional Orders for Fifteen Chip-to-Substrate Thermo-Compression Bonding Tools Driven by AI Tailwind

ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and ...
IEEE

Diver: Oracle-Guided SMT Solver Testing with Unrestricted Random Mutations

Abstract: We present Diver, a novel technique for effectively finding critical bugs in SMT solvers. Ensuring the correctness of SMT solvers is becoming increasingly important as many applications use ...
EE World Online

Miniature SMT test point for dense PCBs

The New Miniature SMT Test Point from Keystone Electronics Corp. features a symmetrical flat-wire design that supports ...
Electronics360

3 areas where AI lives in the electronics manufacturing stack

Today, AI is covering the whole stack of data analysis-based applications, starting at the wafer level and culminating in PCB assembly. Once a design is in assembly, AI primarily makes way into ...