Abstract: In advanced CMOS technology nodes with Cu/low-k interconnect, metal hard-mask approach AIO etch is the key process to define the physical structure of Cu line and via. The via hole and via ...
Abstract: This paper introduces a novel and simple etching technique that utilizes a mixture of sulfuric acid (H2 SO4) and hydrofluoric acid (HF). This method selectively etches silicon dioxide (SiO2) ...
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