Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, has further elevated its quality assurance capabilities with the installation of the cutting-edge DAGE ...

KYZEN provides effective cleaning solutions to meet challenges in every phase of manufacturing PCBs and other electronic assemblies.

BANNOCKBURN, IL – North American PCB shipments in October were down 11.1% compared to the same month last year, according to IPC's North American PCB Statistical Program. The book-to-bill ratio stands ...

Mr. Krumm joins Flex with more than 20 years of experience across industrial, chemical, and healthcare industries. Previously, he served as Executive Vice President and Chief Financial Officer of APi ...

SENAI, MALAYSIA – VS Industry will remain on a growth track in 2025 on the back of its leadership in trade diversion and ongoing contract discussions, according to a report from UOB Kay Hian (UOBKH) ...

Waterston’s appointment underscores ESCATEC’s commitment to investing in exceptional talent and supporting OEMs with innovative and scalable solutions that drive market success.

With combined (federal and non-federal) funding totaling $1 billion, this investment will support a first-of-its-kind Manufacturing USA semiconductor digital twin institute that will develop digital ...

Foxconn expects the Mexico facility to begin production early next year, with the Taiwan facility beginning production in December.

PEACHTREE CITY, GA – Printed Circuit Engineering Association (PCEA) today opened registration for the 2025 New Product Introduction (NPI) Awards for electronics assembly equipment, materials and ...

MANASSAS, VA – ZESTRON, a global leader in precision cleaning solutions for the electronics manufacturing industry, invites you to a free webinar titled “Elevating Efficiency: Maximizing Efficacy for ...

AUSTIN, TX – Flex has completed the previously announced acquisition of Crown Technical Systems, a provider of integrated power distribution and protection systems.

Shenmao's PF606-P lead-free solder paste is designed specifically for the reverse hybrid assembly process, which uses SAC solder paste and BGA components with LTS balls.